Journal of Systems Engineering and Electronics ›› 2020, Vol. 31 ›› Issue (5): 899-907.doi: 10.23919/JSEE.2020.000059
• Electronics Technology • Previous Articles Next Articles
Boyuan LIU(), Qingping WANG*(), Weiwei WU(), Naichang YUAN()
Received:
2019-08-10
Online:
2020-10-30
Published:
2020-10-30
Contact:
Qingping WANG
E-mail:233933183@qq.com;wangqingping@nudt.edu.cn;wuweiwei@nudt.edu.cn;yuannaichang@nudt.edu.cn
About author:
LIU Boyuan was born in 1991. He received his master's degree from University of Electronic Science and Technology, China. Now he is pursuing his Ph.D. degree in National University of Defense Technology. He is now engaged in projects including Compound Electromagnetic Material and CrossEye Jamming. His research interests include microwave and millimeter wave circuits and system, radar guidance, electronic countermeasures and electromagnetic technology. E-mail: Boyuan LIU, Qingping WANG, Weiwei WU, Naichang YUAN. A transceiver frequency conversion module based on 3D micropackaging technology[J]. Journal of Systems Engineering and Electronics, 2020, 31(5): 899-907.
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